Construction
Key Features
Low contact resistance and high shielding effectiveness.
Good resilient and low compression set.
Good reliable through Accelerated Life Test(ALT).
Good reliable adhesion power to make reliable sticking.
Application Ideas
ESD grounding for electronic equipments.
Fill the EMI gap for electronic equipments.
Specification
| Item No. | Thickness（mm） | Color | Surface Resistance (Ω/sq.in) | Vertical resistivity (Ω/sq.in) | 180° Peel Adhesion (gf/25mm) | Dimension |
| E2303 | 0.03 | 银灰色 | ≤0.5 | ≤0.05 | 600 | Any width x50M |
| E2305 | 0.05 | 银灰色 | ≤0.5 | ≤0.05 | 800 | |
| E2308 | 0.08 | 银灰色 | ≤0.5 | ≤0.05 | 800 | |
| E2310 | 0.1 | 银灰色 | ≤0.5 | ≤0.05 | 1000 | |
| E2315 | 0.15 | 银灰色 | ≤0.5 | ≤0.05 | 1000 | |
| E2320 | 0.2 | 银灰色 | ≤0.5 | ≤0.05 | 1200 | |
| E2325 | 0.25 | 银灰色 | ≤0.5 | ≤0.5 | 1200 | |
| E2330 | 0.3 | 银灰色 | ≤0.5 | ≤0.5 | 1200 | |
| E2305HT | 0.05 | 银灰色 | ≤0.5 | ≤0.5 | 1000 |
